Patents
Patent applications related to IoT witnessed 10% average annual decline in the packaging industry since 2021
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The global packaging industry experienced a 10% annual average decline in the number of IoT-related patent applications between 2021 and 2023. The total number of IoT-related grants decreased by an AAGR of 13% during the same period, according to GlobalData's patent analytics database.
Notably, the number of IoT-related patent applications in the packaging industry was 1,186 since 2021, while 1,010 applications were granted.
The top five assignees by filings accounted for 51% of patent applications
Analysis of patent applications by assignee shows that BIONIME filed the most IoT patents within the packaging industry since 2021. The company filed 110 IoT-related patents since 2021.
It was followed by Daio Seishi (90 applications), Abbott Laboratories (44 applications), Johnson & Johnson (20 applications), and PHC Holdings (16 applications).
The top five assignees by grants accounted for 42% of successful patent grants
Analysis of patent grants by assignee shows that BIONIME was granted 47 patents related to IoT within the packaging industry since 2021. It was followed by Daio Paper (34 grants), Abbott Laboratories (26 grants), FedEx (24 grants), and AYR (16 grants).
Patent activity was driven by China with a 47% share of total patent publications
The largest share of IoT-related patent publications in the packaging industry since 2021 was held by China with 47%, followed by the US (22%) and Japan (7%).
GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.
GlobalData’s Patents Analytics tracks patent filings and grants from official patent offices around the world. Proprietary analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
